Running a reliable, cost-efficient, and agile data center is no easy feat, given today's high-performance applications, high-density IT hardware, and emerging carbon emission regulations. These requirements can indeed pull in opposing directions—efficiency can impact r...

In an exciting culmination of talent and ingenuity, Cadence and McLaren Racing have announced the winner of the Cadence McLaren F1 Racing Team CFD Student Challenge. After months of intense competition and rigorous evaluation, one student has emerged victorious, showcasing th...

In this edition of the Women in CFD series, we are excited to spotlight Sheli Yefet , senior application engineer for the Reality DC Design product at Cadence. Sheli's journey in computational fluid dynamics (CFD) began in her university halls, sparking a flame that has ...

Picture this: Your new hire has completed their mandatory HR training and now needs to ramp up quickly in the tools and technologies that will make them productive. What online courses do you suggest and from where? Or, you ARE the new hire and are feeling a bit lost. You nee...

Robot with First-Person View (FPV) Camera From the initial capture of an athlete crossing the finish line to the poignant victories on the podiums, the role of photography in documenting the iconic moments of the Olympics has been pivotal. Tracing back to its origins, photogr...

‘Virtuoso Meets Maxwell’ is a blog series that explores the Virtuoso RF and Multi-Technology Solutions. So, how does Virtuoso meet Maxwell? This is done by combining the industry leader in custom design, Virtuoso Studio, with powerful EM solvers that address a wide range ...

Silicon Photonics has the potential to revolutionize many industries. Photonics, the science and technology of generating, controlling, and detecting light, has moved into mainstream electronic designs. This is particularly true for communications hardware, where bandwidth de...

Hopefully, you enjoyed our first blog about the “Product pages on Cadence Online Support” and it was useful for you through using and including the Cadence Learning and Support Portal in your daily work. If you are already curious to learn more about the category “resou...

The challenges for 3D IC design are greater than standard chip design - but they are not insurmountable. In this episode of Chalk Talk, Amelia Dalton chats with Vinay Patwardhan from Cadence Design Systems about the variety of challenges faced by 3D IC designers today and how Cadence’s integrated, high-capacity Integrity 3D IC Platform, with its 3D design planning and implementation cockpit, flow manager and co-design capabilities will not only help you with your next 3D IC design.

With increasing design sizes, complexity of advanced nodes, and faster time to market requirements - design teams are looking for scalability, simplicity, flexibility and agility. In today’s Chalk Talk, Amelia Dalton chats with Mahesh Turaga about the details of Cadence’s end to end cloud portfolio, how you can extend your on-prem environment with the push of a button with Cadence’s new hybrid cloud and Cadence’s Cloud solutions you can help you from design creation to systems design and more.

New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.

When your project is at crunch time, a shortage of server capacity can bring your schedule to a crawl. But, the rest of the year, having a bunch of extra servers sitting around idle can be extremely expensive. Cloud-based EDA lets you have exactly the compute resources you need, when you need them. In this episode of Chalk Talk, Amelia Dalton chats with Craig Johnson of Cadence Design Systems about Cadence’s cloud-based EDA solutions.

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Discover how Cadence Integrity 3D-IC is reinventing multi-chiplet design. The Integrity™ 3D-IC Platform provides an industry-first holistic and comprehensive 3D-IC design planning, implementation, and analysis platform to take the full system view and perform system-driven optimization of performance, power, and area (PPA) for chiplets and co-design of interposers, packages, and PCBs for 3D-IC applications